Nondestructive Testing
Scanning Acoustic Microscopy = (C-SAM)
Scanning Acoustic Microscopy is an ultra high frequency pulse-echo ultrasonic imaging system that is used to look inside optically opaque solid samples and view internal features such as defects and construction details. Fundamentally, the advantage of this technology relies on the fact that ultrasound will not pass through air spaces, such as caused by delamination, cracks, voids and porosity, at the typically used frequencies from 10 MHz to 300 MHz.
X-Ray Fluorescence (XRF)
XRF nondestructively measures coatings or films on a sample using fluorescent x-rays. Fluorescent x-rays are characteristic x-rays emitted from a material irradiated by x-rays from an x-ray tube. The fluorescent x-rays have energies specific to the individual elements contained within the sample and thus, can be used to identify those elements. If the sample consists of a base material and coating or film, then the x-rays from that coating or film can be discriminated from that of the base. The intensity can then be measured and the thickness of the coating or film calculated.
Infra-Red Thermal Analysis (IRTA)
Infra-Red Thermal analysis uses a thermal camera along with software to detect and analyze the heat differential generated by a high resistance short on a printed circuit board or assembly. Used as an aid in identifying the location of the short.
Static X-ray ( X-ray)
Utilizing a Faxitron X-Ray cabinet we can quickly radiograph PC boards, components and assemblies. The X-ray can be view on instant film or high resolution X-Ray film.
Real Time X-ray = (Real Time X-ray)
Ball Grid Array (BGA) inspection using our CR Technology real time X-ray imaging system allows us to offer the electronics industry fast turnaround, high-resolution digital X-ray images, and a report including images of defects, which we return with the assemblies. Simple low-resolution X-ray images of BGA’s miss many of the defects we pick up with our high power high resolution Real Time X-ray equipment.
Our inspection includes low and high resolution viewing We use frequent adjustment to the x-ray source and angled viewing to highlight bridges, shorts, odd shaped joints and voiding. If you need an X-ray service for BGA inspection then choose one that has the best tools available. This x-ray service has been employed for many years and we have iprocessed huge quantites of printed circuit cards in this manner
Optical Microscopy BW – COLOR (OM)
Our lab utilizes numerous microscopes that are capable of magnification from 10X to 1000X. Each Microscope has the capability of taking digital images that can be incorporate into a report or even sent by E-mail to customers. This technology provides an instant view of what we have seen and this can be discussed with the customer. Measure capabilities as low as .0001 mm in the X, Y and Z axis are possible.