Material Analysis
Thermal Analysis (TGA – TMA – DSC )
DIFFERENTIAL SCANNING CALORIMETRY (DSC) is used get information on the chemical or physical changes of a sample upon being subjected to a programmed temperature change, it measures the varying temperatures and the transitions reactions. Used to measure transitions and lack of cure in plastics, will detect the heat associated with the glass transition when compared to a standard.
THERMO MECHANICAL ANALYSIS (TMA) Measures dimensional changes in materials. This is used to establish thermal coefficient of expansion (TCE).
THERMAL GRAVIMETRIC ANALYSIS (TGA) Measures weight changes resulting from chemical reactions, decomposition, solvent and water evolution, curing point transitions and oxidation in a wide range of sample materials. Useful in characterizing plastics and other materials that are found in printed circuit boards.
DYE and PRY Analysis (D&P)
Dye and Pry is a method used for the inspection of BGA solder joint connections. A cross sectional analysis of a BGA solder joint gives a view of the connection at a single point of the ball. D&P allows for the inspection of all of the solder joints of a BGA at one time.
Other Analytical Methods for Material Analysis
We are also capable of performing Bond Pull, Die Shear, Lead Fatigue, Micro-Hardness, Cross-Section and Polish and Decapsulation among other things.